PURPOSE: To accurately arrange a shield structure at a discretionary position on a wiring board by forming a conductor layer by metal atom accumulating process so as to cover the wiring.
CONSTITUTION: On a printed board 21, a copper pattern 23A to be shielded and adjacent copper patterns 23B and 23C are provided and the copper pattern 23A is coated with a shielding dummy copper pattern 33 through an insulating layer 24. The dummy pattern 33 is normally grounded. The dummy pattern 33 is composed of a top cover 33a and side parts 33b so as to cover the pattern 23A. Since the dummy pattern 33 is formed by directly accumulating conductor metal atoms based on additive method, it is formed on the pattern 23A by the target pattern accuracy with excellent reproducibility and the accuracy is remarkably improved compared with copper paste printing.
TAMURA TOSHIO
ITO TAKAO
OKAJI AKIMASA
Next Patent: ANTICOAGULANT POLYMERIC MATERIALS FOR MEDICAL USE, THEIR PREPARATION AND APPLICATIONS