Title:
印刷装置、および印刷方法
Document Type and Number:
Japanese Patent JP6864681
Kind Code:
B2
Abstract:
A solder paste printer for which a pressing force of squeegee 62 towards a stencil when spreading solder paste 110, that is, a printing pressure, is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.
Inventors:
Minoru Kinuta
Fukakusa Yoshifumi
Kento Asaoka
Fukakusa Yoshifumi
Kento Asaoka
Application Number:
JP2018523140A
Publication Date:
April 28, 2021
Filing Date:
June 17, 2016
Export Citation:
Assignee:
Fuji corporation
International Classes:
B41F15/42; B41F15/08; B41M1/12; H05K3/34
Domestic Patent References:
| JP11216840A | ||||
| JP2000255029A | ||||
| JP9323400A | ||||
| JP7266539A | ||||
| JP2002273851A | ||||
| JP2001018360A | ||||
| JP9314802A | ||||
| JP2011212926A |
Foreign References:
| US20140331874 |
Attorney, Agent or Firm:
Patent business corporation NEXT
Yasutaka Fukatsu
Yuki Kataoka
Yasutaka Fukatsu
Yuki Kataoka