Title:
モジュラー・デバイスおよびケーブル・アセンブリを含むプローブ・アセンブリおよびシステム
Document Type and Number:
Japanese Patent JP6869983
Kind Code:
B2
Abstract:
Probe assembly includes a modular device configured to detect external signals or emit energy. The modular device has a device array that includes at least one of electrical contacts or optical fiber ends. The probe assembly also includes a cable assembly that is configured to communicatively couple the modular device to a computing system and transmit data signals therethrough. The cable assembly includes an array connector having a connector body that includes a mating side and channels extending through the mating side and the connector body. The cable assembly includes a plurality of communication lines that are disposed within corresponding channels of the connector body. The communication lines have respective end faces that are positioned proximate to the mating side to form a terminal array. The terminal array is aligned with and coupled to the device array of the modular device.
Inventors:
Ryan Peterson
Thomas J. Medina
Gian Wang
Givin Sung
Thomas J. Medina
Gian Wang
Givin Sung
Application Number:
JP2018529520A
Publication Date:
May 12, 2021
Filing Date:
August 26, 2016
Export Citation:
Assignee:
Creganna Unlimited Company
International Classes:
H04R1/06; A61B8/12; H04R17/00; H04R19/00; H04R31/00
Domestic Patent References:
| JP2006194666A | ||||
| JP2012527964A | ||||
| JP7023500A | ||||
| JP2010527167A | ||||
| JP2011223468A | ||||
| JP2015097734A |
Foreign References:
| WO2006040962A1 | ||||
| US5957850 | ||||
| US20090124136 |
Attorney, Agent or Firm:
Samejima Mutsumi
Haruhiko Ema
Haruhiko Ema