PURPOSE: To prevent heat generation and fusing caused by an excessive current flowing in a probe card, and improve the reliability of a probe pin, by mounting a fuse between a power supply probe pin and an electrode.

CONSTITUTION: On the surface of the insulating substrate 21 of a probe card 16, Au-plated Cu wirings 22 are formed, whose outside end-portion constitutes a card electrode 17. Out of the wirings 22, the one connected with a power supply probe pin to which power supply voltage is applied has a structure wherein the wiring is ended half-way. At this part, a fuse 24 is so fixed that both ends are welded to the Au plated Cu wirings. As a result, when a large current concentrates and flows in few pine on account of the short in an integrated circuit, the fuse 24 generates heat and is fused before the probe pin generates heat and is fused. Thereby the failure caused by the heat generation of the power supply probe pin can be eliminated, so that reliability can be improved.