Title:
PROBE FOR INJECTION MOLD AND RUNNERLESS INJECTION MOLDING DEVICE
Document Type and Number:
Japanese Patent JP2534609
Kind Code:
B2
Abstract:
PURPOSE: To provide a probe for an injection mold capable of together supplying electric power from a single power source to both a heater which intermittently heats the point part (tip part) of the probe by a simple constitution and a heater for heating the body part of the probe and to provide a runnerless injection molding device.
CONSTITUTION: A tip heater 7 is constituted of platinum or platinum alloy in which electric resistance is steeply raised according to temperature rise depending on energization. The tip heater 7 is provided in the tip part 3 of a probe. A body heater 8 is constituted of nichrome wire in which rise of electric resistance is little according to temperature rise depending on energization. The body heater 8 is provided in the body part 2 of the probe. In a probe 1a for an injection mold, the tip heater 7 and the body heater 8 are in a serial connection state. The tip part of the probe is approached to the gate part of the mold. The probe 1a for the injection mold is fitted to the runner part of the mold. A power source device is synchronized with a molding stage to control electric power. Electric power is supplied to the tip heater 7 and the body heater 8 in series. A runnerless injection molding device is equipped with the power source device.
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Inventors:
SHINDO HIROSHI
Application Number:
JP2668093A
Publication Date:
September 18, 1996
Filing Date:
February 16, 1993
Export Citation:
Assignee:
SEIKI CO LTD
International Classes:
B29C45/27; B29C45/30; B29C45/73; (IPC1-7): B29C45/27; B29C45/73
Domestic Patent References:
| JP62140385A | ||||
| JP1257019A | ||||
| JP5711017U | ||||
| JP50108969U |
Attorney, Agent or Firm:
Hiroyuki Niwa (1 outside)