To overcome the problem that since the shape a contact section of a probing pad for high frequency with a wafer probe is restricted, mismatching of characteristic impedance occurs, leading to an increase in reflection of signals and insufficient propagation of a high-frequency signal.

In the probing pad for high frequency, a signal conductor 1 formed on a dielectric substrate comprises a pad section 11 which is formed with grounding conductors 2 on both sides and with which the wafer probe is to be brought into contact, a lead-out line section 13 led out from an object to be measured, a matching line section 14 provided on the pad section 11 side, and a connection line section 12 for connecting the pad section 11 and the matching line section 14. K characteristic impedance of the pad section 11 is set larger than that of the wafer probe, while a characteristic impedance of the matching line section 14 is set smaller than that of the wafer probe; and an electrical length of the connection line section 12 and the matching line section 14 combined is set 0.16 times as large as a free space wavelength of a high-frequency signal which has the maximum frequency to be adopted.