Title:
処理の制御パラメータの決定方法、及び計測システム
Document Type and Number:
Japanese Patent JP7108562
Kind Code:
B2
Abstract:
A sample simulates a processing state of a semiconductor sample and is measured by a measurement device. The sample includes: a first surface formed at a first height when viewed from a sample surface; a second surface formed at a second height higher than the first height; and a plurality of inflow parts which allow a particle for performing processing on the first surface to flow between the first surface and the second surface. The processing by the particle flowing from the inflow parts is superimposed in at least a part of a region to be processed on the first surface, and the region where the processing is superimposed on the first surface is measured by the measurement device.
Inventors:
Nakata Encyclopedia
Takeshi Omori
Usui Kento
Yu Kurihara
Naoyuki Koto
Takeshi Omori
Usui Kento
Yu Kurihara
Naoyuki Koto
Application Number:
JP2019030494A
Publication Date:
July 28, 2022
Filing Date:
February 22, 2019
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L21/02; G01B11/24; G01B21/20; G03F7/20; H01L21/3065; H01L21/66
Domestic Patent References:
| JP2008153334A | ||||
| JP2002016119A | ||||
| JP2017539078A | ||||
| JP2008218709A | ||||
| JP2009043900A | ||||
| JP2007173334A |
Foreign References:
| WO2018153866A1 |
Attorney, Agent or Firm:
Fujio Patent Office