To facilitate good-looking and accurate slit forming and cutting of a probe film and the like laminated with a hard layer and a soft layer by installing the first and second optical systems which direct the first and second laser oscillators with different wavelength and strength, a processing stage selectively movable to the first and second processing regions, and laser lights to a processing region.

This laser processing device 30 is equipped with; an optical system of a laser oscillator 34 for outputting laser lights 32a, 32b, filter mirrors 40a, 42a, 40b, 42b, collimators 44a, 44b, diaphragms 46a, 46b, light condensing lenses 50a, 50b, and the like; and a processing stage 62. A table 66, to which a film like workpiece is mounted, is moved to the first processing region via an alignment position 64 by a XY stage 68, and is then moved to the second processing region after processing a metal layer of the workpiece with the laser light 32a of comparatively large output. Furthermore, a resin layer is processed with the laser light 32b of comparatively small output, so as to prevent the damage of a resin layer slit.