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Title:
加工用素材及びそれを用いる成型部材
Document Type and Number:
Japanese Patent JP4601707
Kind Code:
B2
Abstract:
Provided are a material for processing which is significantly improved in vibration damping performance, sound insulation performance and sound absorption performance and is capable of reducing the weight of, and improving the mechanical strength of, a product, and a molded member using such a material for processing. With a metal cover 1a, a thin metal plate 6 for forming a material 24 for processing has many through-holes 22. Thus, the material 24 for processing has the through-holes 22 in itself. When the material 24 for processing vibrates and air passes the through-holes 22, the energy is attenuated by the friction of an end face 32 which is a part of each of through-holes 22 of the material 22 for processing and the air. Therefore, the energy of sound wave, which is vibration of air, is converted into thermal energy, and so the sound absorption performance is provided. The frequency band in which the sound absorption performance is provided is determined based on the size and shape such as equivalent hole diameter D1 of the through-holes 22, the numerical aperture, the thickness of the plate and the like.

Inventors:
Issei Akimoto
Domoto Yoshinori
Juichi Yamagiwa
Kyoko Masuda
Mitsuo Hino
Application Number:
JP2009029654A
Publication Date:
December 22, 2010
Filing Date:
February 12, 2009
Export Citation:
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Assignee:
Sanwa Packing Industry Co., Ltd.
KABUSHIKI KAISHA KOBE SEIKO SHO
International Classes:
F01N13/14; B21D47/00; F02B77/11; F02B77/13; B21D13/10
Domestic Patent References:
JP2001347323A
JP2004360496A
JP2005188400A
Attorney, Agent or Firm:
Yoshiaki Nagata
Motoaki Nagata
Eiji Ota
Tamako Tsutada
Masato Tsuda
Tetsuji Nakamura
Katsuyuki Tomita
Husband