Title:
PROCESSING METHOD BY HYDROFORMING, DIE, DIE MODULE, AND PROCESSING APPARATUS OF HYDROFORMING
Document Type and Number:
Japanese Patent JP2023037121
Kind Code:
A
Abstract:
To control a thickness of a workpiece with higher accuracy.SOLUTION: A processing method by hydroforming includes: an aligning step of aligning a tubular workpiece on a die formed according to a first direction corresponding to an extension direction of the workpiece; a lubricant supply step of supplying a lubricant in a center area of a flat surface part interposed by corner parts of a cross section of a die of an inner side surface of the die in a width direction orthogonal to the first direction of the workpiece; a forming step of deforming the workpiece along the inner side surface of the die by supplying a liquid from a supply source different from a supply source of the lubricant to the inner side of the workpiece while supplying the lubricant, and applying a pressure from an inner side of the workpiece.SELECTED DRAWING: Figure 3
Inventors:
KUBOTA HIROAKI
MIKAMI TAKUTO
MIKAMI TAKUTO
Application Number:
JP2021143672A
Publication Date:
March 15, 2023
Filing Date:
September 03, 2021
Export Citation:
Assignee:
UNIV TOKAI
International Classes:
B21D26/033
Attorney, Agent or Firm:
One IP Patent Attorney Corporation