Title:
PROCESSING METHOD AND HOLDING TABLE
Document Type and Number:
Japanese Patent JP2022160952
Kind Code:
A
Abstract:
To provide a processing method and a holding table capable of suppressing a variation in the depth of a groove formed in a package substrate having warpage.SOLUTION: There is provided a processing method which is a processing method of a package substrate having warpage and in which a division scheduled line is set, and the method comprises: a preparation step 101 for preparing a holding table which has a holding face curved in correspondence with the warpage of the package substrate to be processed; a holding step 102 for holding the substrate on the holding table; and a cutting step 104 for, after the holding step 102 is executed, cutting the package substrate along the division scheduled line by a cutting blade.SELECTED DRAWING: Figure 6
Inventors:
IWASAKI KENICHI
Application Number:
JP2021065503A
Publication Date:
October 20, 2022
Filing Date:
April 07, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B27/06; B24B41/06; H01L21/301
Attorney, Agent or Firm:
Sakai International Patent Office