Title:
PROCESSING SYSTEM AND PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2019191723
Kind Code:
A
Abstract:
To provide a laser cutting processing system and a method capable of determining whether or not a layout of a product to be processed can be determined without placing a target material on a pallet of a laser processing machine.SOLUTION: A laser cutting method in a laser processing machine, comprises the steps of: (a) attaching a shape jig whose shape and dimension are known in advance to an arbitrary material stored in a material storage unit; (b) photographing the material to which the shape jig is attached with a mobile terminal; (c) on the basis of the information of the shape jig, performing a bird's-eye view process on an image of the material photographed by the mobile terminal and displaying an image on a display unit of the mobile terminal; (d) on the basis of the processing data input to the mobile terminal, displaying an image of a product to be processed next to be superimposed on the image of the material on the display unit; and (e) determining from the superimposed image displayed on the mobile terminal whether the product to be processed can be processed in the material.SELECTED DRAWING: Figure 6
Inventors:
MIYAMOTO HARUO
Application Number:
JP2018081143A
Publication Date:
October 31, 2019
Filing Date:
April 20, 2018
Export Citation:
Assignee:
AMADA HOLDINGS CO LTD
International Classes:
G05B19/418; G05B19/4093
Domestic Patent References:
| JP2011141807A | 2011-07-21 | |||
| JP2010266202A | 2010-11-25 | |||
| JPH1039912A | 1998-02-13 |
Foreign References:
| US20170115656A1 | 2017-04-27 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu