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Title:
PRODUCTION OF CIRCUIT BOARD STATIC ELECTRICITY PREVENTING MULTILAYER SHEET AND CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP3105630
Kind Code:
B2
Abstract:

PURPOSE: To accurately align a joining position and facilitate automatization with simple structure.
CONSTITUTION: An adhesive layer 20 is formed on the surface of conductive sheet 14 and a first peeling layer 26 which can be peeled off from the adhesive layer 20 is provided. A second peeling layer 24, which can be peeled off from the conductive sheet 14, is provided on the surface opposite to the adhesive layer 20 having the conductive sheet 14 in between.


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Inventors:
Morio Tada
Yasuyoshi Terasaki
Application Number:
JP9218792A
Publication Date:
November 06, 2000
Filing Date:
March 18, 1992
Export Citation:
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Assignee:
Hokuriku Electric Industry Co., Ltd.
International Classes:
H05K9/00; H05K1/02; H05K3/28; (IPC1-7): H05K9/00
Domestic Patent References:
JP62272599A
JP59202698A
Attorney, Agent or Firm:
Isao Hirosawa



 
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