To obtain the subject resin soluble in an aqueous solution of alkali, excellent in hydrophilic property and suitable as a polymer component for alkali-developing type photosensitive resin component for production of printed circuit boards, etc., by using a specific method starting from a polyoxyalkylene- containing hydrophilic dicarboxylic acid and a diisocyanate.
This polyamide-based resin is obtained by reacting (A) a hydrophilic dicarboxylic acid containing a polyoxyalkylene (preferably polyoxyalkyleneamide dicarboxylic acid) with (B) a diisocyanate or diamine (preferably aromatic diisocyanate) to afford a polyamide intermediate, reacting the intermediate with (C) an epoxy resin (preferably bisphenol A type or bisphenol F type epoxy resin) and reacting the resultant polyamide-based resin intermediate with (D) a polyhydric carboxylic acid monoanhydride (preferably tetrahydrophthalic anhydride). Furthermore, weight-average molecular weight of the objective resin is preferably 30,000 to 100,000 from the viewpoints of heat resistance, flexibility, etc.
NISHIZAWA HIROSHI (JP)
HIRAYAMA TAKAO (JP)
HIRAKURA HIROAKI (JP)
Next Patent: POLYIMIDE AND ITS PRODUCTION, AND GAS SEPARABLE MEMBRANE BY USING THE SAME AND ITS PRODUCTION