Title:
PRODUCTION OF IMPROVED COPPER AND TUNGSTEN COMPOSITE MATERIAL
Document Type and Number:
Japanese Patent JP3137923
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To impart density close to theoretical value to a composite material and to attain the speed-up and stabilization of the production by obtaining a copper/ tungsten composite material by mixing copper powder contg. copper oxide and tungsten powder, compacting this mixture and thereafter executing reduction sintering in a hydrogen atmosphere.
SOLUTION: A mixture of copper oxide grains and metallic tungsten grains having 0.3 to 10μm average grain size is sprayed and dried, which is formed into flowable aggregated powder having ≤35° stabilization angle and a hole flow rate of ≤40sec per 50g and is compacted. After that, this compacted body is subjected to reduction sintering in an atmosphere composed of hydrogen and water vapor saturated at 20°C and is formed into a composite material. Furthermore, at the time of compacting the aggregated powder, preferably, an organic binder and a sintering assistant are added, and, as to the content of oxygen in the compacted body, it is contained at least by ≥50mol with the content of copper as a standard, and it is the one sufficient for forming an eutectic of copper oxide and metallic copper in the process of the sintering. In this way, the density of the sintered composite material is regulated to ≥95% to the theoretical density.
Inventors:
David E. Jech
Juan El. Sepulveda
Anthony B. Traverson
Juan El. Sepulveda
Anthony B. Traverson
Application Number:
JP11728797A
Publication Date:
February 26, 2001
Filing Date:
May 07, 1997
Export Citation:
Assignee:
Blush Wellman, Inc.
International Classes:
B22F3/00; B22F3/10; B22F3/23; C22C1/04; C22C1/05; (IPC1-7): B22F3/10; C22C1/04
Domestic Patent References:
| JP5544558A | ||||
| JP6128604A | ||||
| JP4928828B1 |
Other References:
【文献】米国特許5439638(US,A)
【文献】米国特許3382066(US,A)
【文献】米国特許3382066(US,A)
Attorney, Agent or Firm:
Shusaku Yamamoto