PURPOSE: To enable production of a thin tape made of a low melting point solder alloy consisting essentially of a specific amt. of Bi by ejecting the melt of said alloy onto a rotary metallic roll in a specific temp. range.
CONSTITUTION: The molten low melting solder alloy 4 consisting of 40W70wt% Bi and the balance ≥1 kinds among Sn, Pb and In is held at a temp. higher by 10W120°C than the m.p. in a crucible 2. Compressed air or the like is introduced into the crucible 2 to pressurize the surface of the molten alloy 4 so that the molten alloy 4 is ejected through a nozzle 3 onto the metallic roll 1 under high- speed rotation. The molten alloy 4 is thus solidified directly into the tape shape by the roll 1, by which the low melting solder alloy tape 5 is obtd. Workability is remarkably improved and failure owing to impact, etc. is prevented if the above-mentioned tape is used for soldering of a Bi-Te or other compd. semiconductor and a Cu substrate, etc.
KIKUCHI SUKEYUKI
SHIROYAMA KAISUKE
| JPS5485120A | 1979-07-06 | |||
| JPS5450434A | 1979-04-20 | |||
| JPS5597854A | 1980-07-25 | |||
| JPS54104454A | 1979-08-16 |
Next Patent: NOZZLE FOR APPARATUS FOR PRODUCING EXTRA-THIN-WALLED TAPE