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Patent Searching and Data


Title:
PRODUCTION OF METAL FOIL-CLAD LAMINATED BOARD
Document Type and Number:
Japanese Patent JPS62235335
Kind Code:
A
Abstract:

PURPOSE: To obtain the titled laminated board having high frequency characteristic, heat resistance, dimensional stability, etc., by providing an adhesive layer of a polyphenylene oxide based resin composition without containing an inorganic filler between a core material of the polyphenylene oxide based resin composition and a metal foil.

CONSTITUTION: An adhesive layer of a polyphenylene oxide based resin composition consisting of 50W95pts.wt. polyphenylene oxide, 5W45pts.wt. crosslinking polymer and 1W20pts.wt. crosslinking monomer is provided between a core material of a polyphenylene oxide based resin composition consisting of preferably 20W80pts.wt. polyphenylene oxide, preferably poly(2,6-dimethyl-1,4-phenylene oxide), etc., preferably 5W45pts.wt. crosslinking polymer, preferably 1,2- polybutadiene, etc., preferably 1W20pts.wt. crosslinking monomer, preferably triallyl cyanurate, etc., and preferably 1W500pts.wt. inorganic filler, preferably glass flakes, etc., and a metal foil to afford the aimed laminated board.


Inventors:
KOSEKI TAKAYOSHI
SAKAMOTO TAKAAKI
ITO MUNEHIKO
MAEDA SHUJI
HEIUCHI TAKAHIRO
Application Number:
JP7867386A
Publication Date:
October 15, 1987
Filing Date:
April 04, 1986
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08J5/12; B32B7/02; B32B15/08; (IPC1-7): B32B7/02; B32B15/08; C08J5/12
Attorney, Agent or Firm:
Takehiko Matsumoto