To provide a method for producing a moisture-curable polyether- modified silicon which is suitable to be used as a sealant, has a very low chlorine content, and is excellent in weatherability.
A moisture-curable polyether-modified silicon having a chlorine content of 10 ppm or lower is produced by reacting a reactive silicon compound with a polyepoxy polyether compound formed by the reaction of a peroxide and a terminally unsaturated polyether compound represented by formula (1), wherein R is a hydrocarbon group, a reaction residue of a polyisocyanate, a residue formed by removing a hydroxyl group from a polycarboxylic acid, a carbonyl group, or a residue formed by removing a hydroxyl group from a poly-N-alkylolamine; R1 is a 2-12C alkylene; R2 is a 1-4C alkylene; R3 is H or methyl; n is 1-1,000; m is 0 or 1; and k is 2-6 or by reacting a reactive silicon compound with a reaction product of the polyepoxy polyether compound and a polyamine compound.
NANIWA KIMIYOSHI
ASAKAWA YUTAKA
MASUDA MICHIHARU
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