Title:
PRODUCTION OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2633424
Kind Code:
B2
Abstract:
PURPOSE: To prevent thermal shock on a bridge and a component on solder rise on the component mounting plane, prevent a bridge between front-rear conducting through holes and prevent invasion of corrosive substance into the front-rear conducting through hole after components are mounted on a highly dense and accurate printed wiring board.
CONSTITUTION: SR patterns 6 are provided on the both sides of a board 12 and the SR pattern 6 and an SR pattern 11 are provided on the SR pattern 6 in that order so as to close a front-rear conducting through hole 1. The SR pattern 11 is thicker than the SR pattern 6 and tolerable film strength for the thermal expansion of the air in the front-rear conducting through hole 1 is provided.
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Inventors:
TERANISHI HIDEKI
Application Number:
JP26158291A
Publication Date:
July 23, 1997
Filing Date:
October 09, 1991
Export Citation:
Assignee:
TOYAMA NIPPON DENKI KK
International Classes:
H05K3/28; (IPC1-7): H05K3/28
Domestic Patent References:
| JP563342A | ||||
| JP1187996A | ||||
| JP267786A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)