PRODUCTION OF RESIN MOLDING WITH MINUTE DENT ON SURFACE

Japanese Patent JPH08259714

A

PURPOSE: To produce at a low cost a resin molding which has minute dents on the surface and is excellent in adhesion to a metal by attaching or embedding a powder sol. in a liq. chemical to or in the surface of a resin molding and then dissolving and removing the powder with the chemical.

CONSTITUTION: A photosensitive insulating resin is applied to a substrate having a metal circuit pattern formed thereonto, form a coating resin layer. A powder (e.g. a silicone resin powder) sol. in a liq. chemical (e.g. sulfuric acid) is applied to the surface of the resin layer to be attached to or embedded in the surface. Then, the powder is dissolved with the liq. chemical and removed to form minute dents on the surface. A circuit pattern is formed by forming a metal plating pattern on the resin layer by the additive or subtractive method. A multilayer printed circuit board is obtd. by repeating the above process. Thus, the surface of a resin layer is roughened safely at a low cost.

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KINASHI KEIICHI
CHIBA REIKO
HAGIWARA YOSHICHI

JP8314895A

October 08, 1996

March 15, 1995

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GRACE W R & CO

C08J7/00; C08J7/02; C08J9/26; C09J5/02; H05K3/38; H05K3/46; (IPC1-7): C08J7/00; C08J7/02; H05K3/38; H05K3/46

Kyozo Yuasa (6 people outside)

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