Title:
PRODUCTION OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5271979
Kind Code:
A
Abstract:
PURPOSE:To reduce the number of works and increase bonding strength by forming laminated metal film wiring without using chemical etching and plating processes.
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Inventors:
NAKAMURA MASARU
Application Number:
JP14798975A
Publication Date:
June 15, 1977
Filing Date:
December 11, 1975
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/3205; H01L21/28; (IPC1-7): H01L21/28; H01L21/88