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Title:
PRODUCTION OF SLIDING CONTACT MATERIAL
Document Type and Number:
Japanese Patent JPH07258809
Kind Code:
A
Abstract:

PURPOSE: To obtain a stable sliding contact material excellent in wear resistance and reduced in contact resistance by subjecting a material, consisting of Ag, Pd, Cu, and trace amounts of Ni, to solution heat treatment in the course of working.

CONSTITUTION: Solution heat treatment is applied to a material having a composition consisting of, by weight, 20-50% Ag, 20-50% Pd, 20-50% Cu, and 0.01-0.5% Ni, in the course of working. It is desirable that solution heat treatment consists of heat treatment at 680-775°C and is done in an inert gas atmosphere. Although the coarsening of crystalline grains can be prevented by the above procedure, this effect cannot be produced when heat treatment temp. is below the lower limit, and, when it exceeds the upper limit, Cu is precipitated in crystalline grain boundaries and contact resistance is increased and made unstable and also wear is increased. It is preferable to perform rapid cooling in water after that, by which low temp. precipitation can be prevented. By using this contact material, fine Cu grains are precipitated by wear heat at the time of sliding, Joule's heat, and arc heat and act as an antifriction material on a sliding surface. Further, because no coarse crystalline grain is formed and Cu is not precipitated in the crystalline grain boundaries, contact resistance is reduced and stabilized.


Inventors:
HAYASHI HISASHI
Application Number:
JP7647794A
Publication Date:
October 09, 1995
Filing Date:
March 23, 1994
Export Citation:
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Assignee:
TANAKA PRECIOUS METAL IND
International Classes:
C22F1/14; C22C30/02; C22F1/00; H01H11/04; H01R39/20; (IPC1-7): C22F1/14; C22C30/02; H01H11/04; H01R39/20