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Patent Searching and Data


Title:
PUNCHING METHOD AND PUNCHING DEVICE
Document Type and Number:
Japanese Patent JP2005199381
Kind Code:
A
Abstract:

To provide a punching device with simple configuration which can reduce detachment of a coated film on a workpiece, dust generation, and bending of metal foils constituting a current collector, and also to provide a method using the same.

The punching method comprises punching the workpiece 9 fixed to a die with a punch using a punching die 1 equipped with the die 5, 7 and the punch 3, and the device using the same is provided. The workpiece is punched with the punch through a sheet member 17, so that working force applied to the workpiece is reduced and generation of bending of the foils on a cut surface of the workpiece is prevented. In addition the detachment of the coated film on the workpiece is prevented and dust or the like caused by the punching is prevented from adhering to the die.


Inventors:
MIYAHARA KUNIO
SUZUKI KOICHI
ISHIKAWA YUJI
OTSUKA MASAYUKI
ENDO SEIICHI
Application Number:
JP2004007796A
Publication Date:
July 28, 2005
Filing Date:
January 15, 2004
Export Citation:
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Assignee:
TDK CORP
International Classes:
B26D7/06; B26F1/40; H01G13/00; H01M4/139; (IPC1-7): B26F1/40; B26D7/06
Attorney, Agent or Firm:
Masao Okabe
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa
Takao Matsui