Title:
ＲＦ方式の超小型モーションセンサーモジュール
Document Type and Number:
Japanese Patent JP7279122
Kind Code:
B2
Abstract:
The present invention relates to an RF type micro motion sensor module, which includes: a first printed circuit board having an upper surface on which a transmitting/receiving antenna for transmitting and receiving RF waveforms is formed and a lower surface on which an RF driving circuit for transmitting/receiving RF waveforms and a signal amplification circuit for amplifying a received RF signal are formed; a second printed circuit board having an upper surface on which a control circuit for controlling a motion sensor is formed; a shield can surrounding the RF driving circuit and the amplification circuit, which are a high-frequency part, and blocking interference of electromagnetic waves generated from the inside and the outside; and a shielding part having a shape of a square box with open upper and lower parts, coupled between the lower surface of the first printed circuit board and the upper surface of the second printed circuit board, and doubly blocking interference of electromagnetic waves generated from the inside and the outside of the RF driving circuit and the amplification circuit. The present invention can stably maintain the shielding function of the shield can.
Inventors:
Kyo Sung Shin
John Min Ko
John Min Ko
Application Number:
JP2021144645A
Publication Date:
May 22, 2023
Filing Date:
September 06, 2021
Export Citation:
Assignee:
The US Company Limited
International Classes:
H05K9/00; H01Q1/27; H04B1/38
Domestic Patent References:
| JP5564443A | ||||
| JP10308590A | ||||
| JP2006253170A | ||||
| JP201321671A |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mihiro
Tatsuhiko Abe
Shinya Mihiro
Tatsuhiko Abe
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