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Title:
RADIATION SENSITIVE RESIN COMPOSITION, AND INTERLAYER INSULATING FILM AND METHOD FOR FORMING THE SAME
Document Type and Number:
Japanese Patent JP2011133498
Kind Code:
A
Abstract:

To provide a radiation sensitive resin composition which exhibits excellent uniformity in film thickness and has high radiation sensitivity even if a slit coating method is adopted as a coating method, and has such a development margin that a favorable pattern shape can be formed even if an optimal developing time has elapsed passed in a developing step, and an interlayer insulating film having various excellent performance such as high heat and solvent resistance, high transmittance and a low dielectric constant.

The radiation sensitive resin composition comprises: (A) an alkali-soluble resin, (B) a 1,2-quinonediazide compound; and (C) a specific polymer having a silicone chain. The interlayer insulating film is formed of the radiation sensitive resin composition.


Inventors:
HANAMURA MASAAKI
NAGAYA KATSUYA
MARUYAMA TAKUYUKI
Application Number:
JP2009283589A
Publication Date:
July 07, 2011
Filing Date:
December 15, 2009
Export Citation:
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Assignee:
JSR CORP
International Classes:
G03F7/004; C08G59/48; G03F7/023; G03F7/075; G03F7/40
Domestic Patent References:
JP2007147809A2007-06-14
JP2008286936A2008-11-27
JP2000181055A2000-06-30
JP2008040187A2008-02-21
JP2005107130A2005-04-21
JP2005114920A2005-04-28
JPH10230154A1998-09-02
JP2000102727A2000-04-11
JP2004002733A2004-01-08
JP2001269564A2001-10-02
JP2007148186A2007-06-14
JP2007147809A2007-06-14
JP2008286936A2008-11-27
JP2000181055A2000-06-30
JP2008040187A2008-02-21
JP2005107130A2005-04-21
JP2005114920A2005-04-28
Attorney, Agent or Firm:
Masataka Oshima
Hideo Katsumata
Taizo Shiraishi



 
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