RADIO COMMUNICATION CIRCUIT AND INTEGRATED CIRCUIT

Title:

RADIO COMMUNICATION CIRCUIT AND INTEGRATED CIRCUIT

Document Type and Number:

Japanese Patent JP2015201511

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a radio communication apparatus which cancels signal leakage in radio communication between laminated chips and between the chip and a substrate in an integrated circuit where a plurality of chips are laminated.SOLUTION: The radio communication apparatus is configured to perform communication between the laminated chips and between the chip and the substrate through capacitive coupling or inductive coupling. The radio communication apparatus includes: the substrate including a high effective dielectric constant area or a high effective permeability area; a transmitter formed from a transmission circuit mounted on the substrate, a transmission antenna and a transmission antenna area surface where the transmission antenna is disposed; and a receiver formed from a reception circuit mounted on the chip, a reception antenna and a reception antenna area surface where the reception antenna is disposed.

Inventors:

URABE JUNICHIRO
SHIBATA TETSUYA
SUZUKI EIJI
SUZUKI KENJI

Application Number:

JP2014078672A

Publication Date:

November 12, 2015

Filing Date:

April 07, 2014

Export Citation:

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Assignee:

TDK CORP

International Classes:

H01L21/822; H01L27/04; H01Q15/08; H01Q23/00; H04B1/38

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