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Title:
Radio module
Document Type and Number:
Japanese Patent JP5971566
Kind Code:
B2
Abstract:
A wireless module, in which a first board (11) and a second board (12) are laminated, includes connecting members (18) which are connected to at least one of the first board (11) and the second board (12), and form a gap allowing mounting of mounting components including a semiconductor device (14) between the first board (11) and the second board (12). The connecting members (18) are arranged such that a plurality of connecting members (18A, 18B) are arranged uniformly in a planar direction of the boards of the wireless module.

Inventors:
Taku Fujita
Ryosuke Shiozaki
Toshiaki Nakamura
Junichi Kimura
Application Number:
JP2013548093A
Publication Date:
August 17, 2016
Filing Date:
December 06, 2012
Export Citation:
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Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H01Q23/00; H05K1/14
Domestic Patent References:
JP2002271101A
JP2009266979A
Attorney, Agent or Firm:
Patent business corporation glory patent office
Kimihide Hashimoto
Yoshiaki Masaaki



 
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