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Title:
REACTIVE HOT-MELT ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2001011419
Kind Code:
A
Abstract:

To provide a reactive hot-melt adhesive composition having an excellent initial adhesion strength, elasticity and slip property of the adhesive layer surface before curing within the ordinary temperature range.

This composition comprises 20 to 80 wt.% isocyanate group- terminated urethane prepolymer (A), obtained by allowing a polymer polyol comprising a polyester polyol (a) having a number average molecular weight of 500 to 8,000, to react with excessive organic polyisocyanate (b), 10 to 80 wt.% adhesion-imparting resin (B), 0.1 to 8 wt.% waxes (C) and 0.01 to 4 wt.% silicone oil.


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Inventors:
KITAGAWA KENJI
ICHIHARA EIJI
KAWAKAMI TAKANORI
HORIIE TAKAFUMI
Application Number:
JP18641599A
Publication Date:
January 16, 2001
Filing Date:
June 30, 1999
Export Citation:
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Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C08J5/12; C08G18/10; C08G77/04; C08L75/06; C09J175/06; (IPC1-7): C09J175/06; C08G18/10; C08G77/04; C08J5/12; C08L75/06



 
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