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Patent Searching and Data


Title:
REACTIVE PURGE COMPOUND FOR POLYMER PURGING
Document Type and Number:
Japanese Patent JP2014074178
Kind Code:
A
Abstract:

To provide a reactive purge compound for cleaning polymer processing equipment.

A reactive purge compound includes a polymeric carrier component of at least 50 wt.% based on the total weight of the reactive purge compound, where the polymeric carrier component is one or more polymers; a chain scission catalyst component dispersed in the polymeric carrier component; and a water generating component. The reactive purge compound is a feedstock material in the form of a plurality of pellets.


Inventors:
SHIDA MITSUZO
CHEN WEN-LI ADAM
Application Number:
JP2013260561A
Publication Date:
April 24, 2014
Filing Date:
December 17, 2013
Export Citation:
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Assignee:
MSI TECHNOLOGY LLC
International Classes:
B29C48/27; C08L23/00; C08K3/00; C08K5/09; C08K5/17; C08L29/04; C08L67/00; C08L77/00; B29C48/04
Attorney, Agent or Firm:
Kazuhiro Kiyohara