Title:
微小電気機械素子の製造におけるエッチング電荷ダメージの低減
Document Type and Number:
Japanese Patent JP4603039
Kind Code:
B2
Abstract:
A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.
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Inventors:
Tan, Min-Howe
Garry, Brian James
Clams, Manish
Chui, Clarence
Batty, john
Garry, Brian James
Clams, Manish
Chui, Clarence
Batty, john
Application Number:
JP2007511399A
Publication Date:
December 22, 2010
Filing Date:
April 20, 2005
Export Citation:
Assignee:
QUALCOMM MEMS Technologies, Inc.
International Classes:
B81C1/00; B81B3/00; B81B7/00; G02B26/08
Domestic Patent References:
| JP8020616B2 | ||||
| JP2002283299A | ||||
| JP2003168755A |
Foreign References:
| US20040051929 |
Attorney, Agent or Firm:
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Katsumura Hiro
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Katsumura Hiro