Title:
RELEASE DEVICE OF INJECTION MOLD
Document Type and Number:
Japanese Patent JP3259898
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To simplify a structure of a multistage release device.
SOLUTION: An ejection pin 14 is ejected to an initial release position [ejection quantity (s)] and a final release position (ejection quantity S) and a slide core 16 is set to a movable stroke (d) [almost (s)] to be moved up to the initial release position in synchronous relation to the ejection pin 14 and subsequently stopped to eject only the ejection pin 14 and, at this time, a boss 18 is released from the leading end 30 of the slide core 16. By this constitution, at first, the part relatively low in release resistance of an injection-molded product 12 is previously released at the initial release position and, at this time, the boss 18 large in release resistance is integrally moved along with the slide core 16 being a member on a mold side and, thereafter, this part large in release resistance is released at the final release position.
Inventors:
Masaaki Matsuda
Application Number:
JP30976196A
Publication Date:
February 25, 2002
Filing Date:
November 20, 1996
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
B29C33/44; B29C45/33; B29C45/40; (IPC1-7): B29C45/40; B29C33/44; B29C45/33
Domestic Patent References:
| JP63128923A | ||||
| JP6325519U |
Attorney, Agent or Firm:
Kiyomitsu Komatsu
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