Title:
帯電防止性を有する離型フィルム
Document Type and Number:
Japanese Patent JP4949450
Kind Code:
B2
Abstract:
To provide a mold release film in which curing impediment can be inhibited even when a mold release layer is formed on the surface of an antistatic layer, and which is excellent in detachability and has an outstanding antistatic property.
In the mold release film with an antistatic property, an antistatic layer obtained by photocuring a photocuring type coating agent consisting of a polyalkylene dioxythiophene based, poly aniline based or polypyrrol based conductive polymer, a photoinitiator, and a binder is formed on the surface of a base film; and a mold release layer consisting of an addition type silicone resin is formed on the surface of the antistatic layer.
COPYRIGHT: (C)2010,JPO&INPIT
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Inventors:
Yasushi Sasaki
Tomomi Fukaya
Tomomi Fukaya
Application Number:
JP2009235770A
Publication Date:
June 06, 2012
Filing Date:
October 09, 2009
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
B32B27/18; B32B27/00; B32B27/30; C08L101/12; C09K3/16
Domestic Patent References:
| JP2000052495A | ||||
| JP11300895A | ||||
| JP2000025110A | ||||
| JP200396410A |
Attorney, Agent or Firm:
Shinobu Orikuchi