Title:
REMOVAL OF EPOXY
Document Type and Number:
Japanese Patent JPS63172746
Kind Code:
A
Abstract:
The cleaning compositions of the present invention comprise pyridine or substituted pyridines alone or in admixture with sulfoxides. The present invention is employed to treat integrated circuit modules enclosed in a cap or can. Following treatment the cap or can, which is sealed to the substrate by means of the cured epoxy, can be removed to allow rework. The preferred method of removing the cured epoxy from module substrates is by refluxing in the solution. The cured epoxy is totally removed and there is no attack of the Al-Cu or Sn-Pb metallurgies or chip polyimide passivation. The silicone overcoat material is not removed from behind the chips, eliminating the need to reapply the material after rework.
Inventors:
HARORUDO JIYOOJI RINDA
ERIZABESU TERESA MAFUII
DENISU JIYON PORII
ERIZABESU TERESA MAFUII
DENISU JIYON PORII
Application Number:
JP29791587A
Publication Date:
July 16, 1988
Filing Date:
November 27, 1987
Export Citation:
Assignee:
IBM
International Classes:
C08J11/04; C08J11/00; C09D9/00; H01L21/56; H05K3/28; (IPC1-7): C08J11/04; H01L21/56
Attorney, Agent or Firm:
Jiro Yamamoto (1 person outside)