Title:
REMOVAL METHOD OF UNNECESSARY RESIN MOLD OF LEAD FRAME AND REMOVAL DEVICE OF UNNECESSARY RESIN MOLD
Document Type and Number:
Japanese Patent JP2606582
Kind Code:
B2
Abstract:
PURPOSE: To surely remove an unnecessary resin mold and to prevent impact from being applied to a lead frame during the removal.
CONSTITUTION: Approximately the entirety of an unnecessary resin mold is held fixed vertically from before warp deformation of a lead frame 1 to after warp deformation thereof. Force pushing an unnecessary resin mold concentrates to a part which adheres to the lead frame 1 in a gate runner 5. Therefore, the whole unnecessary resin mold is entirely removed from the lead frame 1. Since nothing is in contact with the unnecessary resin mold intermittently, impact is not applied to the lead frame 1 and the lead frame does not vibrate up and down.
Inventors:
Fujiwara Toshikatsu
Application Number:
JP10626594A
Publication Date:
May 07, 1997
Filing Date:
April 22, 1994
Export Citation:
Assignee:
NEC
International Classes:
B29C45/02; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C45/02
Attorney, Agent or Firm:
Masaki Yamakawa