Title:
REPAIRING METHOD OF METAL WIRING
Document Type and Number:
Japanese Patent JP3157772
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a simple and highly reliable repairing method of defects (disconnections and the like) of metal wiring in the glass substrate of a color liquid crystal panel and the like.
SOLUTION: An insulating film 3 is formed on the entire face of a substrate 1 containing the disconnection part of lower metal wiring 2 and is coated with positive photoresist 4. A first opening part 4a is formed on a positive photoresist 4 on the disconnection part, and then a second opening part 3a is formed on the insulating film 3 with the resist as a mask. Next, a positive photoresist 4 is peeled off, and the insulating film 3 is coated with an upper metal film 5. Then, the disconnection part is coated with the upper metal film 5 so as to execute restoration. A negative photoresist 6 is etched as a mask, and upper metal wiring 8 and repairing metal 7 are separated.
Inventors:
Norihiro Sakudo
Application Number:
JP6271798A
Publication Date:
April 16, 2001
Filing Date:
March 13, 1998
Export Citation:
Assignee:
Kagoshima NEC Corporation
International Classes:
H01L23/52; G02F1/1343; G02F1/1345; H01L21/3205; H05K3/22; (IPC1-7): H01L21/3205; G02F1/1343
Domestic Patent References:
| JP384928A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)