Title:
樹脂被覆無機粒子、熱硬化性樹脂組成物、半導体装置、樹脂被覆無機粒子の製造方法
Document Type and Number:
Japanese Patent JP7501105
Kind Code:
B2
Abstract:
To provide a resin-coated inorganic particle excellent in thermal conductivity.SOLUTION: A resin-coated inorganic particle of the present invention comprises (a) inorganic particles and (b) a resin covering the surface of the inorganic particle (a), and the resin (b) includes a resin (b1) having two or more mesogenic skeletons in the molecule.SELECTED DRAWING: None
Inventors:
Tomo Kashino
Application Number:
JP2020089968A
Publication Date:
June 18, 2024
Filing Date:
May 22, 2020
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08J3/16; C08G59/14; C08J3/215; C08K9/06; C08L63/00; C09C1/00; C09C1/02; C09C1/28; C09C1/40; C09C3/10
Domestic Patent References:
| JP2017128662A | ||||
| JP2012052087A | ||||
| JP2016035075A | ||||
| JP2011094005A | ||||
| JP2012041507A | ||||
| JP5051541A | ||||
| JP2011236376A |
Foreign References:
| WO2015033834A1 |
Attorney, Agent or Firm:
Shinji Hayami