Title:
RESIN COMPOSITION FOR ADHESION AND SEALING
Document Type and Number:
Japanese Patent JP2002173658
Kind Code:
A
Abstract:
To enable a constant adhesive strength to be secured, a stuck part to be easily separated in a comparatively low-temperature condition, and a new part to be stuck thereto again without problems.
This thermoset type resin composition comprises an oxetane resin as a thermoset resin, a thermoplastic resin and a curing agent. Preferably, the oxetane resin is selected from the group consisting of bis(oxetane) carbonate, bis(oxetane) adipate, xylylene-bis(oxetane), 3-ethyl-3-hydroxymethyloxetane and benzyloxetane.
Inventors:
YAGI TOMOHISA
IMAIZUMI NOBUHIRO
IMAIZUMI NOBUHIRO
Application Number:
JP2000371215A
Publication Date:
June 21, 2002
Filing Date:
December 06, 2000
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
C08K5/00; C08L71/02; C08L101/00; C09J131/04; C09J167/00; C09J171/00; C09J201/00; H01L21/52; H01L23/29; H01L23/31; (IPC1-7): C09J171/00; C08K5/00; C08L71/02; C08L101/00; C09J131/04; C09J167/00; C09J201/00; H01L21/52; H01L23/29; H01L23/31
Domestic Patent References:
| JP2001303016A | 2001-10-31 | |||
| JP2001207150A | 2001-07-31 |
Attorney, Agent or Firm:
Minoru Yoshida (2 outside)