To improve the heat resistance, mechanical properties, electrical properties, low water absorption, adhesion, solvent resistance and molding properties by incorporating a polyquinoline resin and a bisallylnadicimide compd.

A difluoro monomer having a quinoline ring, a diol monomer, a monofluoro hydroxy monomer as necessary and a base are heated in an anhydrous solvent at 100-125°C for 1-24 hr, eliminating water azeotropically to form a polyquinoline resin having a number average mol.wt. (converted value using a working curve of a standard polystyrene according to gel permeation chromatography) of 5,000-200,000. One to 99.9 pts.wt. of the polyquinoline resin and 0.1-99 pts.wt. of a bisallylandicimide compd. represented by the formula are blended to form 100 pts.wt. of a resin compsn. A soln. formed by dissolving 3-80 wt.% of the resin compsn. into an org. solvent is cast on to a substrate, dried at 100-250°C to from an adhesive film. In the formula, Ar1 is a divalent org. group having at least one carbon.