Title:
樹脂組成物、接着剤層、及びそれらを用いて作製した半導体装置
Document Type and Number:
Japanese Patent JP5266797
Kind Code:
B2
Abstract:
To provide a resin composition providing excellent coating operability, and having excellent adhesive characteristics to a copper surface while keeping the adhesive characteristics to a silver-plated surface, and to provide a highly reliable semiconductor device hardly causing separation after high-temperature reflow treatment by using the resin composition.
The resin composition contains (A) electroconductive particles, (B) a thermosetting resin, and (C1) a compound having a sulfide bond and an alkoxysilyl group and (C2) a compound having a sulfide bond and a hydroxy group. The adhesive layer and the semiconductor device produced by using the resin composition are also provided.
COPYRIGHT: (C)2009,JPO&INPIT
Inventors:
Nobuki Tanaka
Mitsuru Okubo
Mitsuru Okubo
Application Number:
JP2008052849A
Publication Date:
August 21, 2013
Filing Date:
March 04, 2008
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08L101/00; C08F290/06; C08K3/00; C08K5/372; C08K5/548; C09J9/02; C09J11/04; C09J11/06; C09J201/00; H01L21/52; H01L23/36
Domestic Patent References:
| JP2002316976A | ||||
| JP2007262243A | ||||
| JP2009191214A | ||||
| JP2009203416A |