Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION AND COATED MOLDING THEREOF
Document Type and Number:
Japanese Patent JPH10298425
Kind Code:
A
Abstract:

To obtain a resin composition which gives give films excellent in surface touch and slipperiness by mixing a resin composition prepared by mixing a urethane resin having a specified number-average molecular weight with a polyimide in a specified ratio with an organic solvent in a specified ratio.

This composition is a coating composition containing 5-80 wt.% resin composition obtained by mixing 100 pts.wt. urethane resin having a number-average molecular weight of 5,000-300,000 with 90-400 pts.wt. polyimide and 95-20 wt.% organic solvent. The urethane resin solution is produced by reacting a diisocyanate with a polyol and a diol or a diamine in an equivalent ratio of 2/1/1 to 5/1/4 in a solvent such as dimethylformamide. The polyimide used is obtained by heating an aminodicarboxylic acid capable of a self- condensation cyclization reaction such as maleamic acid or aspartic acid and is exemplified by a polysuccinimide having a number-average molecular weight of 500 200,000. The coating composition is prepared by mixing the urethane solution with specified amounts of the polyimide, an isocyanate curing agent and various additives.


Inventors:
UCHIDA SHINJI
MUKAI SEIICHI
TOMITA MASAYUKI
NAKATO TAKESHI
Application Number:
JP10958597A
Publication Date:
November 10, 1998
Filing Date:
April 25, 1997
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI CHEM CORP
International Classes:
C08L75/04; C08L79/08; C09D175/04; (IPC1-7): C08L75/04; C08L79/08; C09D175/04
Attorney, Agent or Firm:
Hasegawa Moji