Title:
RESIN COMPOSITION, AND COVERLAY FILM, ADHESIVE SHEET, METALLIC FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE OR PRINTED WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2023139012
Kind Code:
A
Abstract:
To provide a coverlay and an adhesive sheet which are excellent in resin flow characteristics in secondary processing, and a circuit board using the same.SOLUTION: A resin composition is used in an adhesive layer of a laminated substrate, wherein when a laminate is formed by sandwiching a sheet-shaped completely-cured material with a thickness of 25 μm with a polyimide film with a thickness of 125 μm having the same sheet shape from both surfaces, the laminate is punched and a disk-shaped test sample is prepared, the test sample is subjected to hot press from a thickness direction under the conditions of 160°C, 2 MPa and 30 minutes, an average value of maximum lengths (specifically, secondary resin flow amount) of a resin flowing out to the outside from the outer periphery of the test sample is less than 0.15 mm.SELECTED DRAWING: None
Inventors:
OKABE SHUNYA
HAYASHI NAOKI
SHIMOKAWAJI TOMOHIRO
HAYASHI NAOKI
SHIMOKAWAJI TOMOHIRO
Application Number:
JP2023109228A
Publication Date:
October 03, 2023
Filing Date:
July 03, 2023
Export Citation:
Assignee:
NIKKAN IND
International Classes:
C09J123/26; B32B15/08; B32B15/085; B32B27/00; C08G59/58; C08L23/26; C08L63/00; C09J7/35; C09J163/00; H05K1/03
Attorney, Agent or Firm:
Ryuhei Nishimura
Shindai Saito
Atsushi Nakamura
Haruko Maeda
Shindai Saito
Atsushi Nakamura
Haruko Maeda