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Patent Searching and Data


Title:
RESIN COMPOSITION FOR ELECTRICAL INSULATION
Document Type and Number:
Japanese Patent JPS6028418
Kind Code:
A
Abstract:

PURPOSE: To provide the titled resin composition having excellent electrical characteristics, physical properties and moisture resistance, and containing a butadiene polymer having acryl group, a bisphenol A epoxy resin having acryl group, a polymerizable vinyl monomer and an organic peroxide as essential components.

CONSTITUTION: The objective resin composition is prepared by compounding (A) a butadiene polymer having (meth)acryl group [e.g. a polymer prepared by introducing the group of formula (R1 is H or methyl) to the skeleton of a butadiene polymer], (B) a bisphenol A-type or novolac-type epoxy resin having (meth)acryl group, (C) a polymerizable vinyl monomer (e.g. methyl acrylate), (D) an organic peroxide (e.g. hydroperoxides) and if necessary (E) a filler, a flame retardant, etc.


Inventors:
HARA HAJIME
ARAKI YOSHIHIKO
ISHIYAMA SADAYUKI
ENOMOTO MASAMI
Application Number:
JP13671083A
Publication Date:
February 13, 1985
Filing Date:
July 28, 1983
Export Citation:
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Assignee:
NIPPON OIL CO LTD
International Classes:
C08F299/00; C08F290/00; C08F299/02; C08G59/00; C08G59/18; C08G59/40; H01B3/40; H01B3/44; (IPC1-7): C08F299/00; C08F299/02; C08G59/18; H01B3/40; H01B3/44
Domestic Patent References:
JPS5137102A1976-03-29
JPS55129459A1980-10-07
JPS55152712A1980-11-28
Attorney, Agent or Firm:
Tatsuo Ito