Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION AND LAMINATE AND PACKAGE USING THE SAME
Document Type and Number:
Japanese Patent JP2004018536
Kind Code:
A
Abstract:

To provide a resin composition easily controlling the hygroscopicity which is an index to drying performances, retaining persistence of the drying performances and strength properties as a laminate and a package and having drying functions and to provide the laminate and package using the resin composition.

The resin composition is obtained by compounding 100 pts. wt. of a resin composition comprising 50-99 wt.% of a polyolefin resin (resin A) compounded with 1-50 wt.% of a blend resin (resin B) containing an ethylene-α, β-unsaturated carboxylic acid or its ionically cross-linked material with 1-100 pts. wt. of a water absorbing and hygroscopic inorganic compound. The resin composition has the drying functions.


Inventors:
SUZUTA MASAYOSHI
KUROSAWA AKIO
YOSHINAGA MASANOBU
WADA KIYOSHI
KITAJIMA TOMOAKI
Application Number:
JP2002171102A
Publication Date:
January 22, 2004
Filing Date:
June 12, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B32B27/32; B65D65/40; C08K3/00; C08L23/00; B65D65/02; (IPC1-7): C08L23/00; B32B27/32; B65D65/02; B65D65/40; C08K3/00
Domestic Patent References:
JPH10204229A1998-08-04
JPH0539379A1993-02-19
JPS62212451A1987-09-18
JP2002127331A2002-05-08
JPH0595871U1993-12-27
JP2001114262A2001-04-24
JP2003523431A2003-08-05
Foreign References:
US6214255B12001-04-10