Title:
Resin composition and molded article made of the resin composition
Document Type and Number:
Japanese Patent JP6295962
Kind Code:
B2
Abstract:
The invention is a resin composition comprising an alkoxysilyl group-containing hydrogenated block copolymer [3], and a hydrocarbon-based polymer [4] having a number average molecular weight of 300 to 5000, the resin composition comprising the hydrocarbon-based polymer [4] in an amount of 1 to 50 parts by weight based on 100 parts by weight of the alkoxysilyl group-containing hydrogenated block copolymer [3], the alkoxysilyl group-containing hydrogenated block copolymer [3] being obtained by introducing an alkoxysilyl group into a hydrogenated block copolymer [2] that is obtained by hydrogenating 90% or more of unsaturated bonds of a block copolymer [1] that comprises at least two polymer blocks [A] and at least one polymer block [B], the polymer block [A] comprising a repeating unit derived from an aromatic vinyl compound as a main component, the polymer block [B] comprising a repeating unit derived from a linear conjugated diene compound as a main component, and a ratio (wA:wB) of a weight fraction wA of the polymer block [A] in the block copolymer [1] to a weight fraction wB of the polymer block [B] in the block copolymer [1] being 30:70 to 65:35. The invention is also a formed article obtained by forming the resin composition. The invention provides a resin composition particularly suitable for: a solar cell element sealing material having low hygroscopicity, non-hydrolyzability, weather resistance, transparency, and improved flexibility to prevent cracking of the cell during vacuum lamination; and an adhesive for laminated glass having transparency, light resistance, the ability to prevent scattering of cracked glass at low temperature, and excellent adhesiveness at low temperature.
Inventors:
Atsushi Ishiguro
Ryuta Kurihara
Youhei Koide
Chiba Avenue
Ryuta Kurihara
Youhei Koide
Chiba Avenue
Application Number:
JP2014546999A
Publication Date:
March 20, 2018
Filing Date:
November 13, 2013
Export Citation:
Assignee:
Zeon Corporation
International Classes:
C08L51/00; C08L23/20; C08L53/02
Domestic Patent References:
| JP62218468A | ||||
| JP58132032A |
Foreign References:
| WO2012043708A1 | ||||
| WO2011096389A1 | ||||
| WO2009151029A1 |
Attorney, Agent or Firm:
Haruhito Oishi
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