RESIN COMPOSITION AND MULTILAYER PACKAGING MATERIAL USING THE SAME

Title:

RESIN COMPOSITION AND MULTILAYER PACKAGING MATERIAL USING THE SAME

Document Type and Number:

Japanese Patent JP2004010679

Kind Code:

A

Abstract:

To obtain a resin composition which exhibits stable melt viscosity and has excellent moldability and productivity, and a multilayer packaging material provided with an intermediate layer composed of the resin composition.

The resin composition comprises at least two kinds of resins selected from a resin group containing a functional group and/or a double bond and a polyfunctional monomer or its anhydride capable of reacting with the resins.

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Inventors:

KIKUCHI ATSUSHI
KOMATSU IKUO
YAMADA TOSHIKI
KITANO YOSHIHIRO

Application Number:

JP2002163410A

Publication Date:

January 15, 2004

Filing Date:

June 04, 2002

Export Citation:

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Assignee:

TOYO SEIKAN KAISHA LTD

International Classes:

B65D1/00; B32B27/36; B65D1/09; B65D65/02; C08G83/00; C08K3/00; C08K5/00; C08L101/00; (IPC1-7): C08G83/00; B32B27/36; B65D1/09; B65D65/02; C08K3/00; C08K5/00; C08L101/00

Attorney, Agent or Firm:

Naozumi Ono
Sachiko Okunuki

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