Title:
RESIN COMPOSITION AND PLATE-LIKE BODY
Document Type and Number:
Japanese Patent JP2007138095
Kind Code:
A
Abstract:
To provide a resin composition excellent in mechanical strength, low thermal expansion and heat resistance, and also having sufficient high-frequency property and capable of maintaining the high-frequency property with time, and to provide various plate-like bodies.
The resin composition comprises a thermosetting resin and a hydrophobicized inorganic porous body. In this resin composition, it is preferable that the inorganic porous body be contained at 0.1-80 pts.mass based on 100 pts.mass of the thermosetting resin. The plate-like bodies each comprises this resin composition.
Inventors:
GOTO NOBUHIRO
Application Number:
JP2005336800A
Publication Date:
June 07, 2007
Filing Date:
November 22, 2005
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L101/00; B32B15/088; B32B15/092; C08K9/06; C08L63/00; C08L79/08; C09J7/00; C09J11/04; C09J163/00; C09J179/08; H05K1/03
Domestic Patent References:
| JPS60245664A | 1985-12-05 | |||
| JPH10212336A | 1998-08-11 | |||
| JP2000183539A | 2000-06-30 | |||
| JP2001098174A | 2001-04-10 | |||
| JP2002003724A | 2002-01-09 | |||
| JP2003171531A | 2003-06-20 | |||
| JP2003171577A | 2003-06-20 | |||
| JP2002338230A | 2002-11-27 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Shinji Oga
Toshifumi Onuki
Shinji Oga
Toshifumi Onuki
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