Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板
Document Type and Number:
Japanese Patent JP7316572
Kind Code:
B2
Abstract:
A resin composition is provided and includes (A) a modified polyphenylene ether compound terminal-modified with a substituent having a carbon-carbon unsaturated double bond, (B) a maleimide compound containing no phenylmaleimide group and having a hydrocarbon group having 10 or more carbon atoms in the molecule thereof, and (C) at least one selected from a maleimide compound containing a phenylmaleimide group and a maleimide compound having an aliphatic hydrocarbon group having 9 or less carbon atoms in the molecule thereof, in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.

Inventors:
Daimei Umehara
royal family
Hiroharu Inoue
Application Number:
JP2020509817A
Publication Date:
July 28, 2023
Filing Date:
March 11, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
C08F290/06; B32B15/08; C08J5/24; C08L71/12; H05K1/03
Domestic Patent References:
JP2016204639A
JP2004067727A
JP2004059644A
JP53134087A
JP58015515A
JP2009263569A
JP2012197336A
JP2014086591A
JP5649773B2
JP2009161725A
JP2017206578A
JP2014101398A
Foreign References:
US20140349090
WO2014181456A1
WO2016031555A1
WO2016117554A1
Attorney, Agent or Firm:
Masataka Kotani
Aya Usami