Title:
樹脂組成物、保護材及びこれを用いた電子機器
Document Type and Number:
Japanese Patent JP7212232
Kind Code:
B2
Abstract:
To provide a resin composition having excellent coating properties, flexibility, and heat resistance, and a protective material.SOLUTION: The present invention relates to a liquid resin composition that is curable, the liquid resin composition at least having, as the main components, aliphatic or alicyclic monofunctional (meth) acrylate monomers, styrenic thermoplastic elastomers dissolved in the (meth) acrylate monomers, maleimide compounds, imide (meth) acrylate monomers, and radical polymerization initiators.SELECTED DRAWING: None
Inventors:
Makoto Aizawa
Application Number:
JP2018206153A
Publication Date:
January 25, 2023
Filing Date:
October 31, 2018
Export Citation:
Assignee:
Sekisui Polymatec Co., Ltd.
International Classes:
C08F2/44; C08F220/52; H01L23/12; H01L23/29; H01L23/31
Domestic Patent References:
| JP2015131866A | ||||
| JP2000239616A | ||||
| JP2008277796A |
Attorney, Agent or Firm:
Shogo Otake
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