To provide a resin composition exhibiting good adhesiveness to Ni-Pd plated lead frames, and to provide a semiconductor device which uses the resin composition as a die attach paste for semiconductors and has excellent reflow-resistant reliability.

This resin composition is characterized by comprising (A) a sulfur atom-containing compound having an unsaturated bond, (B) a polymerization initiator, and (C) a filler, and the semiconductor is characterized by being manufactured using the resin composition as a die attach paste.