Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP5413522
Kind Code:
B1
Abstract:
[Problem] To provide a novel resin composition whereby a plating conductor layer exhibits adequately high peel strength despite the surface of an insulation layer having not only a low arithmetic mean roughness (Ra value) but also a low root-mean-square roughness (Rq value) after a wet roughening process. [Solution] The purpose of the present invention is achieved by a resin composition containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C) which is surface-treated with an epoxy resin.
Inventors:
Kazuhiko Tsurui
Shigeo Nakamura
Shiro Tatsumi
Shigeo Nakamura
Shiro Tatsumi
Application Number:
JP2012553132A
Publication Date:
February 12, 2014
Filing Date:
January 23, 2012
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; C08G59/04; C08J5/24; C08K9/04; C09J7/02; C09J163/00; H01L23/12
Domestic Patent References:
| JP2009235359A | 2009-10-15 | |||
| JP2002114891A | 2002-04-16 | |||
| JPH05222165A | 1993-08-31 | |||
| JP2008174624A | 2008-07-31 | |||
| JPH04370159A | 1992-12-22 | |||
| JP2010275334A | 2010-12-09 |
Attorney, Agent or Firm:
Hiroaki Sakai
Tadashi Terasaki
Takuya Kashima
Tadashi Terasaki
Takuya Kashima